A. Chip: The use of monocrystal silicon wafers (or III-V group, such as gallium arsenide) as the base, and then the use of lithography, doping, CMP and other technologies to make MOSFET or BJT components, and then the use of thin film and CMP technology to make wires, so as to complete the chip manufacturing.

B. Integrated circuit: The selection of a certain process, the transistors, resistors, capacitors and inductors required in a circuit and wiring interconnect together, manufactured on a small or several small pieces of semiconductor chips or dielectric substrate, and then packaged in a tube shell.