Mobile devices such as mobile phones and wearable electronics are widely used. The electronic circuit in the mobile terminal operates at a low operating voltage, such as 5V, to reduce power consumption and extend the service time of the mobile terminal. As the operating voltage decreases, the high voltage that the electronic circuit can withstand also decreases. A transient voltage suppressor (TVS) with a low breakdown voltage is required to protect the electronic circuit.

For the protection of high-speed transmission lines, transient voltage suppressors must have a high response speed in order to provide the required protection. The response speed of transient voltage suppressor is mainly affected by its own capacitance. In order to improve the response speed, the capacitance of the transient voltage suppressor is preferably set to less than 0.5pF. Further, the transient voltage suppressor should also have a high electrostatic discharge (abbreviated ESD) capability.

In order to support multiple high-speed transmission lines, a multi-channel transient voltage suppressor can be formed in the same chip. Since the different channels in the multichannel voltage suppressor can share a single Zener diode, the number of semiconductor devices in the chip can be reduced. However, existing device architectures must employ bonding lines to provide electrical connections between different diodes of multi-channel transient voltage suppressors, which not only increases the packaging cost of the chip, but also increases line resistance and parasitic capacitance, and reduces the reliability of semiconductor devices.

Therefore, it is expected to reduce the use of bond leads in chips integrating multi-channel transient voltage suppressors to reduce package costs and improve reliability.